GIGABYTE B860M DS3H micro ATX motherboard - Intel B860 LGA 1851 Wi-Fi band___Quad-band (2.4 GHz / 5 GHz-1 / 5 GHz-2 / 6 GHz) 5 mm Packaging data Package

5 mm Packaging data Package height 195 mm Package depth 70 mm Package width 175 mm Quantity 1 Logistics data Harmonized System (HS) code 84716070 Other features Package weight 411 kg

- Pre-certified for ISV apps from leaders like Creo® & SOLIDWORKS®

Scratch resistant Card pocket No Desktop stand No Surface coloration Monochromatic Compatibility iPhone 13 Brand compatibility Apple Product colour Transparent Case type Cover Maximum screen size 15

5 mm Height 150

96% DCI-P3

GIGABYTE B860M DS3H micro ATX motherboard - Intel B860 LGA 1851 Wi-Fi band___Quad-band (2.4 GHz / 5 GHz-1 / 5 GHz-2 / 6 GHz) 5 mm Packaging data PackageGIGABYTE B860M DS3H Motherboard Intel Core Ultra Series CPUs, 5+1+2+1 Phases VRM, up to 9066MHz DDR5, 1xPCIe 5. 0 + 1xPCIe 4. 0 M. 2, 2. 5GbE LAN, USB 3. 2 Gen 2 Key Features Motherboard Form Factor: Processor Manufacturer: Processor Socket: Compatible Processors: Number of Memory Slots: Compatible Memory Types: Overview Elevate your computing experience with GIGABYTE's renowned motherboard series: AORUS, AERO, and GIGABYTE. Featuring innovative